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Working with a Manufacturer to Repackage Their Silicon
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shanekent:
Hi All -

This is kind of an odd question/conversation and I'm curious as to whether or not anyone has had experience with something like this...

I'll try to keep this brief.   There is a very niche and specific chip that was offered a few years back in a 28-PDIP, 32-PLCC, and 32-TSOP packages while a few other chips in the same family were being offered in 32-PDIP, 32-PLCC, and 32-TSOP packages.   The manufacturer stopped making the 28-PDIP part that I am most interested, but continues to make the same part in its 32-PLCC and 32-TSOP as well as the other chips in the same family in all of its packages (basically just obsoleted the 28-PDIP package). I'm starting some conversions with the niche manufacturer to see if they'd be willing to do a large quantity run of the specific IC that I need in the 28-PDIP package that I need.  I am well aware that I will need to commit to a large quantity run if we do come to some agreement. 

My thoughts are that the silicon that they are casting into their 32-PLCC or 32-TSOP packages are likely the same since their electrical characteristics are the same (removing thermals from the equation).  So I'm assuming that they would able to install the same silicon into a 28-PDIP package after any upfront tooling costs are paid for, etc.   When this part was offered in a 28-PDIP package it had the same exact electrical specifications as the other packages and a near 1-to-1 pin numbering match to the 32-PLCC (the PLCC just had a few NC pins).

Have any of you had a similar experience to something like this?    Maybe folks who have experience in IC manufacturing can chime in about MOQs for runs like this, typical NRE costs, etc.

Kind of an interesting idea so I'd love to hear your thoughts.

-S
coppice:
Manufacturers are usually reluctant to introduce new packages for a single customer without a large up front payment. However, if they used to make the part in the package you want, so they have everything qualified, you might well be able to get them to bring it back. It will depend on who did the assembly and test for that package, and whether they are still in a position to do more. Remember, a lot of assembly and test places have dropped a lot of their DIP options.
wraper:
Why not just place 32-TSOP onto adapter board?
shanekent:
That's an interesting point about the assembly and test places...  I hadn't thought about that portion.     Is it fair to assume that most manufacturers supply their die to a common assembly house to have them package it into the needed package?    Not something I had thought about as I figured the die creation and packaging happened in the same facility.

Surprisingly the 32-TSOP package is pretty hard to find as they appear to only do small runs.  Most of their common demand now exists for the 32-PLCC package so I've designed an adapter that converts that to the 28-PDIP footprint.   After adding it all up, the socket and the PLCC chip cost around $3 total at 10,000pcs.  I'd probably be willing to order close to 100,000pcs if the unit cost is less than $1.  I'm assuming NREs for an ask like this can easily be in the tens of thousands of dollars range.  Looking for some insight there as well.

-S
james_s:
I know I've seen options to purchase bare dies, I assumed they were for use in ceramic hybrid circuits but there's no reason a 3rd party couldn't put them in a DIP package. One of those epoxy blob COB modules might be another feasible option.
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