Hello everyone.
At the begining sorry for my bad english - I'm now native speaker.
I use CadSoft Eagle for making project, but I have some question related to vias and placing it near components.
I know that vias are always used to connnect SMD components to ground or power planes, but how about THT components?
Should I place some additional GND vias near pads of THT elements? I saw many design almost always there is no additional vias, but I have one multilayer PCB at home and there are vias near main mounting hole.
Second question is similar because how about using additional vias to connect THT element to power plane?
Third question is how about routing AC as a power plane (inner layer) should I place it inside board or maybe it should be routed on top/bottom?
I know that many vias are used to connect SMD components because this will provide low impedance connection to plane and small vias have probably some current limit.
I attach picture to show what I'm talking about.
My board stack up is classic:
1. TOP - signall/hi speed signal + GND,
2. GND plane,
3. VCC surrounded by guard ring connected with multiple vias to GND,
4. GND plane + sometimes some not critical signals like enable pin or something like that.