Thanks, i have loads of pours......and whenever a component has a PTH pad on the bottom, and no trace to it on the bottom...i put a pour over it, so its more fixed if i have to desolder it.
I don't quite understand what you are doing there, but you might be misunderstanding (or abusing) the pour feature.
Do you mean that you use a local pour, set to the signal on the pad, to essentially make a larger pad? If so, I recommend against it. That's asking for trouble if you have to change the layout, e.g. move components around. If you really want larger pads, you should edit the component footprint.
But placing larger pads just to make the pads more robust during the testing & debugging phase seems a bit over the top for my taste. Plated-through, double-sided pads hold up quite well in my experience, even on PCBs from the typical low-cost suppliers. How often do you expect to unsolder the components?