The chip pretty much dictates the way you have to connect. For solderability, you should make the connections cleanly; in that sense the bottom left is a bit messy as pads and traces get mixed.
Electrically, supply should be low impedance i.e. wide tracks, use planes, and above all put bypass caps right next to the supply entry pads. The cap should be already visible in the screengrab you attached.
The cross connections between adjacent pads probably don't do very much unless the pads draw significantly different currents. On the other hand they won't hurt much either.