EEVblog Electronics Community Forum
Electronics => PCB/EDA/CAD => Topic started by: LabSpokane on August 08, 2016, 12:56:37 am
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I'm thinking about moving a project into a backplane arrangement. While i realize chamfering a card edge is easy to do on my own, what's the correct way to handle it when getting a PCB manufactured? Is this done in the Gerbers, or is it simply called out on a drawing and the PCB manufacturer adds it into their programming?
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I suggest asking your supplier how they want it called out (or if they even offer it!). Everyone seems to have different ways of handling mechanical features like these.
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If you are working with a Chinese fab, they call it a gold(en) finger.
Surely that refers to hard plating which may or may not involve an edge chamfer.
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If you are working with a Chinese fab, they call it a gold(en) finger.
Surely that refers to hard plating which may or may not involve an edge chamfer.
That one is called golden chamfered finger in Taiwan and chamfered golden finger in mainland.