The vias don't need to be in dense clusters. A few is enough to ensure a low resistance, low inductance connection.
Prioritize them by placing them closer to component pads. One beside each bypass capacitor, and one inbetween them. One for the reg ground pin.
Feedback path doesn't really matter, but the layout can be made smaller by pulling everything together.
Switching loop is entirely within the regulator, which appears to be either a synchronous or integrated diode type. All that's needed is a bypass cap close between its VCC and GND pins.
You may find it's worthwhile putting a pour on the switching node, and surrounding the inductor's pad. This allows the inductor to dissipate more heat into the board. (You already have this on the output side.)
Everywhere else, pour GND on both layers. Not really anything that needs to be stitched in this design, just the added copper will improve heat dissipation.
Leave a gap between the inductor pads, so the ground can pour between both sides.
Tim