Very cool! How much was the laser?
Unfortunately the way to not burn the substrate is probably by decreasing the pulse width. But that won’t be something you can do with these sorts of lasers.
This is a MOPA Laser and Can Change Pulse Width.
Sorry, what I meant was more that the MOPA lasers from Chinese engravers don't typically go lower than about the ns range I think, but I'm pretty sure that the LPKF lasers that do this are more like 100ps or less (in research or high tech manufacturing, they use femtosecond lasers!). As far as I know, the key to working with very thermally conductive materials like copper and aluminium is maximum energy in minimum time, because you want to basically vaporise or ablate the material as fast as possible to avoid heat damage to other parts of the substrate. So this is one of the areas where shorter and shorter pulses ie ps and fs are driving the research into these lasers.
I haven't actually used one of these, but I would suggest making the pulse width as narrow as possible, and if possible when testing examine the board with a thermal camera to see how much heat is being spread out by thet copper.
Also, I believe the LPKF machines do some hatching process where they slice up tiny regions of copper and then blast them off with an air knife at the same time (I guess maybe they have poor adhesion to the substrate when heated due to degradation of the epoxy).
Definitely try to contact this guy:
- he seems to have a good idea of the process window. Also please report back!