Ground pour under integrated magnetics RJ45

[EPC-EPDAC]

Can anyone offer advice regarding PCB layout of the signal ground and chassis ground under and in the vicinity of an integrated RJ45 with magnetics (dual 10/100/100 ETHERNET)

This is a 6 layer board.

In the past (without integrated magnetics) I would pour chassis ground under the RJ45 up to the PHY side of the separate magnetics, and signal ground under the remainder of the board up to the MAC side of the magnetics, with a void in between the signal and chassis planes under the discrete transformer. I'm not sure what best practices are when using an integrated magnetics module.

[SeanB]

The magnetics on the socket should be shielded, but refer to the manufacturers appnotes to see. Best is probably to leave the pcb there bare so that if you change to one with poor magnetic shielding on the bottom it will not matter.

[free_electron]

Your split is still valid.
The magnetics in the can are shielded by the can (the can is iron)
As long as you maintain the chassis ground an system ground split and then couple them in 1 point through the classic ferrite//cap co struction you are ok.

[EPC-EPDAC]

Thank you, the visit to the EMI lab will be interesting.