After it is all sorted out, PM me who it is, so I don't make a mistake with them. 
Let us ALL know who to avoid!
The person to avoid is Hackvana, that guy is a complete scammer! Oh wait, it's me.
(special shout out to ataradov: I'm not a low life bastard in China, I'm a westerner in Australia)
There are many things that ela_ela didn't mention in his message, and several things where he's quoted a private conversation in public, and quoted me out of context. I hope you'll allow me to set the record straight.
The actual problem he had was that when his assembly company loaded the components, there was bridging between pads of the resistor networks. It's an annoying problem, and I feel for him.
ela_ela's soldermask request was specifically regarding the slivers between the pads of the resistor networks. These slivers, while not anywhere too thin, were removed by the factory.
Here's a picture of a board I did for another customer (shown with permission):

If you look carefully, you can see there's no soldermask between the pads.
For scale, the slot is 0.8mm wide. Original here:
(That customer said that he didn't have any problems with solder bridges)
ela_ela told me that in his opinion, the solder bridges were caused by the removal of the soldermask, and his gripe is that if the factory hadn't removed the soldermask, there wouldn't have been bridges. How dare the factory change his design!
There are two misconceptions which I wish ela_ela understood. (My chat logs say that I've spent more than two hours helping him understand this, but without success)
The first misconception is thinking that in PnP manufacture, bridges are avoided with soldermask. Not so. Bridges are prevented by having the
right amount of solder paste. Here's a pic from an SMTA presentation:

Note that for NSMD (non-soldermask defined) pads, the soldermask doesn't touch the pad.

Note the term "aperture-pad gasketing". That's right, there should be a seal between the side of the stencil aperture, and the pad. Solder paste should not escape.

And you can see here that the solder paste is only on the pad.
(Full document:
http://www.smta.org/chapters/files/Houston_Troubleshooting_The_Stencil_Printing_Process_-_Chrys_Shea.pdf
)
There's an appnote by Atmel that in section 3.7.2, talks about soldermask and fine pitch chips:
http://www.atmel.com/images/atmel-8826-seeprom-pcb-mounting-guidelines-surface-mount-packages-applicationnote.pdfRegarding soldermask between pads, it says:
the web has to be at least 75 microns in width for the solder mask to stick to the PCB surface
If the soldermask is finer, the slivers can break, like this:

Broken slivers can cause soldering problems.
And the app note talks about fine pitch chips:
for finer pitch parts, not enough space is available for the solder mask web
in between the pads. In such cases, it is recommended to use the trench type solder mask opening where a big opening is designed around all the pads on each side of the package with no solder mask in between the pads

So, fine pitch chips can be soldered with no bridges, without soldermask. The secret is having the right amount of paste on the pads. And that depends on the thickness of the stencil, and the size of the stencil aperture.
The second misconception is the idea that what's in your files is what's should be used to make the product. In reality, PCB and stencil factories change the data they receive more than you realise, and for good reason. It's partly to fit your data to the processes they use, and partly because they have years of experience in manufacturing, and they know what works.
Here's what the stencil factory does when they receive your data:
- Check your input files for readability.
- Apply heuristics to match your aperture data to known component sizes.
- Calculate the optimum paste volume and shape for each pad:
- To prevent solder bridges, aperture size may be reduced.
- To get good joints, aperture size may be increased.
- To help with paste release, the shape of the apertures can be modified a little. For example, the ends of rectangular apertures for IC pads are rounded.
The stencil factory also segments and reduces the paste area of large pads.
So what we're seeing here is a difference between CAD (the design) and CAM (what's necessary to make it). The factory uses their expertise to make changes that lead to better manufacturability.
Let's look at an example for a stencil I supplied recently: (used with permission of customer)

You can see the changes that have been made. The under-chip apertures have been "segmented" to prevent too much solder, and the apertures for the pads have been given rounded ends, which helps with paste release when the stencil is lifted.
In the vast majority of cases, the changes made by the factory are helpful. They make manufacturing your product easier. It's a good thing.
There are standards for how stencil thickness and aperture size should be computed (IPC-7525B). Certainly, a stencil aperture which is the same size as the pad is too big. You'll get too much solder paste.
ela_ela got his stencil through the assembler (not through me). I asked him for the the GBP (bottom paste) file to match his GBL (bottom copper) file. He finally supplied it. Here's the two of them superimposed:

What we see here is that the apertures in the GBP file are exactly the same size as in the GBL file. That's not necessarily a problem, because as mentioned, something the stencil factory should do is resize the apertures. But what if the stencil company
didn't resize the apertures? What would happen is that there'd be too much solder on the pads, which would lead to bridges. Hmm. That's my hypothesis for what happened. His problem is not missing soldermask, but unresized apertures. As much as he'd like the two to be related, they're not. Correlation does not imply causation.
I showed a picture before with the CAD and CAM version of a GTP file. A way to test my hypothesis is for ela_ela to ask his assembler for the CAM version of his GTP file, but he refused, saying "there is no assembly company anymore. they quit".
Say
what? Why would an assembler quit? I'll let you draw your own conclusions.
So let's wrap up where we're at with this:
- CAD != CAM, and factories make subtle changes to PCB and stencil data for several reasons, which is often done to improve manufacturability.
- With PnP, soldermask is not for preventing solder bridges.
- Solder bridges are prevented by not having too much solder.
- Stencil apertures should be resized to deliver the right amount of paste.
Without an assembler to pin blame on, he's trying to pin blame on the next nearest thing: me. When I offered a credible explanation for the cause of the problem, he wasn't able to listen and learn. Instead, he came here.
I've done this job for five years, I work hard at providing good service to my customers, and I have a busy IRC channel with many satisfied customers.
Let's not be so quick to judge. You can't know the whole story until you've heard both sides.
Mitch.