If the SMT footprint will fit inside the TH footprint by enough to offer solder mask, then you can just put it in the middle. This may be a situation where a much smaller SMT footprint is helpful.
The problem you will run into is if the copper for TH and SMT touch. That is inviting solder to get sucked down the rabbit hole and leave your SMT component with no solder.
I would probably make a footprint that is two in one, with it shifted to the side.
Something like this with 'O' being a TH pad and [] being an SMT pad.
O--[] O--[]
O--[] O--[]
O--[] O--[]
O--[] O--[]
You could look at the TH pads as free big vias for routing the SMT part, I guess.