The thermal resistance which is given in the datasheet.
They may put some number for that in the datasheet, but I would not trust it. Thermal resistance is highly dependent on the amount of copper that the pins of the IC are soldered to on the PCB. This can easily lower the thermal resistance by a factor of 3 (assuming a small signal opamp).
For power opamps with heatsinks... Heatsinks also have a thermal resistance in their datasheet, Usually it's not just a number, but a graph that shows how thermal distance changes with airspeed. A little bit of air movement has a huge impact, while a huge airspeed only has a small incremental impact. It does not help if air molecules get blown past the heatsink before they have time to absorb some heat. The main goal of the air movement is to remove the "bubble" of hot air close to the heatsink and in between the heatsink fins.
It's good to know some things about thermal calculations, but it is of no use to be very accurate here, because there is just too much variation in the variables involved. In a real (production) environment, the design should always be verified with a thermomenter (thermal camera) and under realistic circumstances (closed housing, possibly under a hot car bonnet etc).