I use sandpaper, fine grit like 240-1500, works fine. Fine grit will not leave any marks deep enough to cause a problem for the film in diy setting.
Sand. Wipe down with acetone, wipe down with water. Get a "spritzing" type travel bottle (i got like 3 for a dollar) and spritz the pcb with a fine mist of water, doesn;t need to be too even. Peel off inside-of-curl of film, lay on the wet pcb, the water helps get it down without air, squish out the water from center out with squeege, or just a paper wad, you can easily lift and reposition. Use clothes iron, warm not hot, 50-70 degrees C, press and iron, until pcb is fully heated, pay special attention to edges. Careful not to overheator blistring of the film will occur. You can test adhesion at this point, failed adhesion can be down to cleaning, or insufficient heating.
Allow to cool. Expose.
Develop in sodium carbonate or percarbonate 30g per litre, gently rubbing with fingers when it starts to work. If it takes more than 3-4 minutes your exposure is too long (or you forgot to remove the top protective layer aftr exposing :-)). I use an old electric toothbrush to assist, especially with close traces.
Now the real trick, re-expose, without the mask for about twice as long, after this second "uv baking" any residue which was left over from developing will be obvious and if necessary you can put in the developer again for 30 seconds to clean it up.
Etch.
Drill if necessary (drill before you strip, makes it easier to see), and then just before you are ready to start soldring, strip it in an acetone bath for a couple minutes, the resist will literally curl up and die.