Author Topic: power place connections/thermal pad  (Read 549 times)

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Offline gogoman

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power place connections/thermal pad
« on: July 21, 2018, 02:26:12 pm »
Hi  I have not layout a board in a while,

Given a four layer board (inner: power ground) using smd components, can the connections to the inner layer be made directly or must a thermal pad/relief be used.
Using a  via  with a angular ring of 20mil  and hole of 10 mils,  what expansion value  is recommend for a thermal relief?

If two thermal relief intersect,  resulting in 2 out of 4 spokes connecting to the plane,  does this pose a manufacturing issue.

thanks
« Last Edit: July 21, 2018, 02:37:17 pm by gogoman »
 

Offline borghese

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Re: power place connections/thermal pad
« Reply #1 on: July 22, 2018, 07:45:10 am »
The thermal relief are normally used with PTH components

With SMD pad there is normally a short track for connection to the power plane that act as thermal relief;
Cheers
Borghese
 


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