I was commenting to the claim that the two capacitors placed by the OP "do not count". Of course they do, even if suboptimal, it's not catastrophic.
Power decoupling capacitors are chosen by impedance at high frequencies, and that is completely defined by their inductance (capacitance is irrelevant when you satisfy a certain minimum), and further, inductance is completely defined by the total loop area, which is simply defined by package size + layout.
Typical 0.1uF is kind of minimum capacitance. There is no harm done if you have more, say 1uF. More than 0.1uF may also be needed with some ICs like high-current gate drivers.
So choosing these puppies is mostly based on package size, price and availability!
For them to perform optimally, use the smallest package size you can handle, and place it as close to the chip as you can. Underlying idea is to minimize the loop: IC Vcc -- cap Vcc -- cap GND -- IC GND.
This being said, it's not set in stone that you need exactly <5mm loop, and 25mm loop would fail to work. It's all about the internal design, IO edge rates and drive strengths of the ICs involved. Some are fine without any decoupling at all, some require near-perfect design. With typical CMOS logic ICs like this, common practice is to include bypass caps every inch or so. Which is at least almost satisfied by the OP. You don't absolutely need to have one cap per IC, the distance between the caps and ICs is more important.
I would be a bit worried about the idea of using just 0.01uF, though. And of course, while at it, move the caps closer as suggested.
And, high-ESR bulk capacitance is almost always a good idea unless you are 100% sure it won't be needed.