EEVblog Electronics Community Forum
Electronics => PCB/EDA/CAD => Topic started by: newtekuser on October 30, 2024, 12:24:16 am
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I have the following 4 layer stack-up and would like to stitch the copper pours for different voltages I have on the PWR plane to the ground planes. Each copper pour on the PWR plane has its own shape and does not cover the entire area of the PWR plane.
The two GND planes are continuous and cover the entire area of the PCB.
L1: SIG
L2: GND
L3: PWR (with copper pours for 5V, 3.3V, 12V)
L4: GND
What would be the best course of action for stitching these copper pours to the GND planes?
A. stitching VIAs around the perimeter of each copper pour
B. stitching VIAs around the perimeter of components
C. stitching VIAs filling each copper pour
D. something else (please advise)
I'm thinking of spacing them like 5-10mm apart and go with option A.
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Robert Feranec has posted some pretty good video's which also so field simulations of what happens inside a PCB when signals change their GND reference to another layer. He has made several video's about this topic, so I can't recommend a single one, but they are easy to find.
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Robert Feranec has posted some pretty good video's which also so field simulations of what happens inside a PCB when signals change their GND reference to another layer. He has made several video's about this topic, so I can't recommend a single one, but they are easy to find.
Found it! :-+ https://www.youtube.com/watch?v=nPx2iqmVAHY (https://www.youtube.com/watch?v=nPx2iqmVAHY)