Hi Marcel_X,
Thank you.
The thickness of the PCB volume is the sum of everything what is between the top and bottom copper, in the stackup setup.
Also the copper thickness is taken from the stackup setup.
But, the board and the copper color is constant. I was a bit afraid about the core through the solder mask color vs core color only, I just set a constant value. I could be more innovative here and use transparency multiplication, maybe later.
Electronic projects are more complex then what is typically rendered by the CAD programs. The underlaying library (Open Cascade) eats a lot of RAM. The limit is 2GB, as the ZofzPCB is 32-bit program. That was far from being a problem before, but now it is a serious limitation. For example the DEMO 1 will not convert to STEP, if all options are enabled (default). That justifies my decision of not including other layers into the export.
My plan is to expel the feature into a separate 64-bit module ASAP. It is faster, safer and more efficient then convert the whole thing to 64 bit. Also, it will cover the fact of substantial memory leak during saving the STEP, as the module will unload after the job is done. I would then permit myself to add other layers to the options.
Still some questions: semi-transparency in STEP, should I try to bulge the external layers on the underlaying copper or just position it above?
In the meanwhile, my try on iPad, using Fusion 360:
https://youtu.be/K4Ly607Xv3s