EEVblog Electronics Community Forum
Electronics => PCB/EDA/CAD => Topic started by: HLA-27b on July 25, 2012, 08:56:25 pm
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Just found this very detailed paper
http://www.smtnet.com/library/files/upload/Reliability_and_Failure_Mechanisms.pdf (http://www.smtnet.com/library/files/upload/Reliability_and_Failure_Mechanisms.pdf)
Apparently small vias can crack during high temperature reflow associated with lead free processes.
Here is a picture worth 1000 words:
(https://www.eevblog.com/forum/general-pcbedacad-discussions/yet-another-pb-free-failure-mode-in-pcbs/?action=dlattach;attach=27706;image)