@asmi - just wondering, did you place the DDR2 further away from the FPGA in the PCB for a reason? Looks like it could have been placed a lot closer?
There are few reasons:
1. This board was designed for hand-assembly, I wanted to leave more space between BGA devices for easier hot air gun soldering.
2. I only had 2 signal layers to work with (and even those are not fully accessible due to part placement), length matching requires quite a bit of space, so I wanted to have lots of it.
3. Making compact board was not a design goal (as it in most cases goes against point 1), anything at 10x10 cm or below was good enough. I could've made it more compact, but in that case it would be next to impossible to assemble it without a reflow oven.
Also, they are not that far away from each other - only about 12.5 mm apart. The scale on photos and in eCAD can be very deceptive if you don't have some reference to see the actual scale. All DDR2 traces are only about 36 mm long, which is far enough from critical length (interface is running at 333 MHz due to package limitations) to be reasonably sure it will work with no termination for address/control lines without doing actual board-level simulations (which I can can't do in KiCAD, I would have to import the PCB into Orcad Pro somehow).