You see people talking a lot about testing and accepting die to work around defects, but its a much smaller activity than you might think outside the leading edge processes, where the yields are still being aggressively worked on. The great majority of dark silicon being sold is perfectly good silicon that has just been turned off for commercial reasons. Its just not worth trying to separate out most wafers into bunches of dies which pass various test specs. The testing might be reduced when turning a wafer into a reduced functionality chip, but they will all either pass or fail just one test spec and move forward on that basis.
Simpler chips can also take different testing routes.
For example MCUs that go for automotive qualification and high temp range might go trough extra testing to satisfy the spec. Even more so for the mil spec stuff (Where you can buy a 7805 regulator in a fancy ceramic package for like 500$ per chip from TI).
Then you have things like voltage reference chips that get sorted into grades by performance (absolute tolerance or temp co.) where the only difference is a single letter after the name.
There are also chips with multiple channels that get artificially handicapped down. Things like ADCs, DACs, Digital Pots...etc where from the datasheet you can clearly see the 8ch, 4 ch, 2ch and 1ch chips are the same die with identical internal registers, they just didn't provide you the pins to hook it up. Often they do give you a smaller chip package to save space, but there are chips out there that use the same package for the 4ch and 1ch version, except that 3 pins are labeled as NC on the 1ch version. You also find families of DAC chips that appear to be exact same chip including the internal registers, but the only difference is that one is 14bit, next one is 12bit next one is 10bit and last one is 8bit.
Some of this is market differentiation so that you can sell the same chip as low spec to cheepskates and at the same time charge a lot the people who are willing to pay for the higher spec. But yield can be a factor with precision analog chips even if they are not pushing the latest and greatest nanometers. Not that the process would produce a chip with faulty transistors, but instead transistors that don't meet the tightly controlled characteristics needed for the chip to be precise