Wraper says and wraper thinks but not a pinch of technical reference to support your warp logics... hahahahaha LOL.
LOL, you posted a link to calculator, I made calculations. You call it warping logic
There is a compromise between surface area / fin count and fin thickness to achieve least thermal resistance in particular volume. If you want to increase fin thickness, you must decrease fin count
. Less fin count, less dissipating area. As with heat pipes distance heat need to travel through the fin is low, low fin thickness is optimal. All heatsink manufacturers must be stupid, Armadillo is smarter than all of them. Also in electronic loads there in no such size, noise, small heat source constrain, therefore cheaper heatsinks with larger size, thicker fins and larger gaps are used. Also such heatsinks are usually extruded, and you cannot extrude 0.4mm fins even if you want.