I have watched some youtube videos showing insertions and removal of various components/ICs using hot air guns, for example you have an IC with 200 pins on its underside and you solder it in place with hot air, which means you have to raise the temperature of the whole area to 260C or more, and that includes the whole component(s), not just the pins and not just one pin at a time.
So for example I have soldered some MOSFETs onto the PCB, where I also soldered their drain (the metal backside) and to do that the whole area has to reach 260C, but the absolute max ratings specify 300C for 10 seconds 1.6mm from case.
Under a hot air gun this component, and others, would reach 260C (or more) on its case, the whole thing.
The explanation I am guessing is that components are much more resilient and can withstand at least 260 C for many seconds, but am I understanding it correctly?