Electronics > KiCad

Fill Properties SMD Pads

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ciikucli:
I created a ground fill on the ground layer and told it to connect the GND net to itself. I see the thermal relief on the through hole GND pins, but I was wondering if it connected the SMD pads as well. I'd like to know if I need vias for every connection.

Also, is it standard practice to add fills to the top and bottom layers of the board once you finish?

HackedFridgeMagnet:
If you plot the file into gerbers you will be able to see what pads it actually connects too.
If everything is correct it will fill to the pads and vias that are connected to the same net but it wont connect to pads on other nets.
Of course if something is physically in the way it wont be able to connect, and you may be left with islands. You will may need to put some extra vias in the board to connect these islands.

ciikucli:
Here's an image of the a couple pads that are supposed to be connected to GND. The two unconnected D19 gray pads need to go to ground.


I'm guessing that since the ground fill is on layer 3 and the pads are on the top layer that they did not connect. If this is accurate, what's the best way to connect the voltage regulators to the GND layer?

HackedFridgeMagnet:

--- Quote ---I'm guessing that since the ground fill is on layer 3 and the pads are on the top layer that they did not connect. If this is accurate, what's the best way to connect the voltage regulators to the GND layer?
--- End quote ---

Yes I was assuming the fill and the pad were on the same layer.

All you need to do is run a small track out from the pad and place a via. The via will connect to all layers that are incident with pads, tracks or fills on the same net.
You can actually put a via in the pad itself if you want to which is electrically better but i find looks a bit confusing and soldering may not be optimal.
On other layers where the via is on a different net to the fill, the fill process will leave a gap around the via.

marshallh:
There is/was an outstanding bug in Kicad where stitching vias would randomly come unconnected and isolated from the net, and then fills would avoid the same net

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