Good points. In this case there's a (possibly) large enough area from the board process without hitting the fingers. With no other routing down there. This is a HASL process dual layer FR4(?) board as a prototype prior to a SMD redesign.
Although I looked at SMD versions of the memory and whooooo boy, not for those prices.
With these I'm looking at my 5 pack of prototype boards and wondering if I could design a process to easily give them a bit of a round or chamfer on the leading edge. Maybe a little easier than "apply file". And I really only need one or two reserved to think about the design with. The rest need to be dedicated to science so they won't end up in a bottomless pit of unused "stuff".
Honestly I couldn't recall having ever sanded off part of a fiberglass resin board for any reason and didn't know if I was missing something obvious that'd make it a non-starter.