Author Topic: Elecrow/iTead soldermask expansion  (Read 3677 times)

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Offline poorchavaTopic starter

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Elecrow/iTead soldermask expansion
« on: June 22, 2013, 04:29:10 pm »

what value do you use for solder mask expansion when designing PCB to be manufactured by itead/elecrow/seeed etc?

According to design rules, the minimum soldermask bridge is 0.2mm (7.874mil). I know that solder mask expansion is supposed to compensate for soldermask/copper registration errors and soldermask shrinkage. I've set it to 3mil, but I still can't achieve reliable soldermask between pads of 0.635mm pitch SOP package.

How low can I go with expansion value without risking some catastrpohic misalignment?
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