Electronics > Manufacturing & Assembly

Elecrow/iTead soldermask expansion



what value do you use for solder mask expansion when designing PCB to be manufactured by itead/elecrow/seeed etc?

According to design rules, the minimum soldermask bridge is 0.2mm (7.874mil). I know that solder mask expansion is supposed to compensate for soldermask/copper registration errors and soldermask shrinkage. I've set it to 3mil, but I still can't achieve reliable soldermask between pads of 0.635mm pitch SOP package.

How low can I go with expansion value without risking some catastrpohic misalignment?


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