Specifically, I'm looking at their TS391AX 63/37 paste and their TS391SNL SAC305 stuff, both no-clean, no-refrigeration types.
I've been using a sryinge of Kester EP256, but my current tube is way past it's expiry date. When heating it flattens out completely, and half the time doesn't appear to melt, instead turning into a dull grey sludge. When it does work, I end up with a lot of solder balls along the sides of passives that I need to clean up. None of which was happening when the paste was fresh, so I'm putting it all down to age. Unfortunately CML Supply is out of stock, but I've found the Chip Quik stuff seems easy to get hold of.
There doesn't seem to be much mention of Chip Quick paste out there though. And they do offer quite a few varieties of solder paste - both the types I mentioned above also seem to have "standard refrigeration" counterparts - so what mitght be said about one type might not hold true for the rest. I'd prefere the no-refrigeration types as I reckon they'll last me longer.
I've thought about trying some GC10, but nobody seems to sell it in small quantities. I do mostly one offs, and somewhat intermittently nowadays, so although a jar of GC10 might be more cost effective, I'd never be able to make use of more than a small fraction of it. Plus comments here indicate it's better suited to stencil use rather than manual placement, which is what I'm almost always doing.
And between the two, should I stick to leaded solder instead of the SAC305? I know the former is traditionally easier to work with, but is the difference that great? Is lead-free paste deserving of its reputation or has it gotten a lot better?
Thanks!