No offense, but I have used older solder pastes perfectly for a very long time. I also blend them together routinely, and make hundreds of boards a day without any issues. The key difference, however, is that the paste must always have the proper consistency (ie. enough flux), and I ALWAYS let it spin in a solder paste mixer for a good 5 to 10 mins right before I use it. I even spin new paste because I dont always know how long it has been sitting around. Expired paste? Same thing. If you dont have a solder paste mixer (which are expensive), then sure, always use new paste because it starts clumping pretty quickly, especially on the surface. This is especially the case if you put left overs back into the container which, once again, you should never do unless you have a mixer.
Also, allot of the issues people are discussing about "issues with older solder paste" such as solder balls, bridging, etc. is best fixed by properly designing their solder stencil. Solder balls have more to do with a too large aperture ratio than anything else. Baseball mount patterns also help allot on the passives. My humble suggestion is to refer to the Printed Circuits Handbook, which is the defacto Bible for everything PCB manufacturing.