For me a killer would be mid-range at nicer prices.
Mid range being for medium density: 2 layers with QFN/QFP and small (max 16 pins) BGAs, 4-5 mil min. tracks/space, 0.1 mm min. solder mask, ENIG, 0.2 mm drill, etc.
Currently there is a big jump from the ultra low cost (max 100x100mm, leaded-HASL, 6-mil track, 0,4 mm min. solder mask, 0.3 mm drill) and that mid-range.
Or at the very least something better on the ENIG and min. solder mask side of things. That would be sufficient to fully unlock the next level of SMD designs hobbyist could practically do at a lower cost.
For shipping cost, it's true that for just a few boards of one design it can be expensive (especially for the ultra low-cost range where hobbyist can just etch themselves to have them faster). But if you support having multiple designs per shipping that can be fine (but your website would need to find a way to promote clearly that way of functioning to lower the shipping costs).
What could also help in such configuration is to allow for different fine grained quantity combinaisons of the different designs (because for the first prototype iterations it is not that often you needs these 5 or 10 pcs... and that feels like a waste after a while). And just bill on the total area used (with min. area if you want, like today we have min quantity). In short: I do understand the fab needs minimum board area for the pooling concept to work. But just let me decide how to spread my uses of that area over different designs of low-volumes prototypes. Of course assuming all the designs use the same panel options.