I'm contemplating which lead free paste to use for production. It'll be with stencils and a (very) basic oven. Low volume (100s not 10000) of units, some QFN no BGA, 0402 smallest parts. I'm using 100C for hand soldering which is great, but contemplating the SN42/BI57/AG for pastes. Boards are ENIG if it matters.
Should I got 100C, SAC305 or the Bi stuff?
100Sn can be brittle as well as prone to creating whiskers, so I would avoid it. It isn't a whole lot cheaper, anyway. I have had quite good results with the SAC305, but the secret is in the FLUX, not the alloy. I got some great stuff from Warton Metals in the UK, but it is really hard to export to the US. You might have a distributor in AU for it. I have just started using Loctite GC10 (might be sold under the Henkel brand there) and it appears to work VERY well.
It was suggested by my board manufacturer to use some electroless gold flash when I first went over to lead-free, and it was an absolute disaster! If the lead soldered to the pad, all was fine, but if it failed to solder, rework was an insane catastrophe. I think this was a case of "black pad". The only way to fix that connection was to bend the component lead up, scrape the black deposit down to bare copper, tin it, and then bend the lead down and solder.
So, I have been using lead-free HASL ever since, and it works quite well.
Type 3 paste has very coarse solder beads, type 4 is finer, type 5 is yet finer. Type 5 costs a lot more, so I am using type 4 now, and it seems to avoid solder bridging. I think the last stuff I had may have been type 3 -- a mistake.
Jon