This seems relevant:
https://ieeexplore.ieee.org/document/6066954/similar#similarYou'll have to find a source / buy if it really matters.
AFAIK, annealing (bringing it up to soldering temperature) helps.
Mind that electroless tin is extremely thin, so it may oxidize through and/or diffuse into the copper (forming Sn-Cu intermetallics), leaving an unsolderable mess. (On the upside, with no metallic tin left, it won't whisker.
) Coating with soldermask, or solder or electroplated tin (heavier than electroless), is best.
I don't have a problem leaving bare copper on proto PCBs, as long as it's not exposed to a corrosive environment.
Regarding NEPP, mind that much of the information is fairly old (circa when RoHS was introduced). Not to say it's outdated or irrelevant -- it is good work, and very much applicable to the materials and processes that were around at the time, and have been for a long time. That's the catch: RoHS processes have improved since then, so the risk with modern commercial components and processes may not be as severe.
(To be clear, at-home electroless tin is probably old tech, not really anything they can refine in the formula I think, so it will still be applicable to that.)
Also, keep in mind, NASA's in the business of
spaceships; if you're just making one-offs, well, that's a very different thing.
Tim