Thanks for taking the time to take all the photos and write it up!
This will likely screw up escapes for internal layers, as they go between dogbone vias right under BGA balls. Having ability to route two traces between balls/vias gives a lot of flexibility and help to reduce amount of layers needed for full breakout.
It's also a big help with the MGTs and Diff pairs. I've got 32 sublvds pairs to break out on the Artix (484 pin). And since bank 14 is needed for configuration, I can't use it for HiSPI, leaving 15 and 16.
It's a tough job getting that many pairs out, with 5 mil trace. I've routed myself into a corner more times than I can count at this point. (Note I'm referring the the FG package, the FB requires smaller pads)
In some cases a second row pair has to split either side of a VSS ball and via. With 4mil one pair fits either side of the ball.
(I don't have m laptop with me today or I'd post a couple screen grabs of the design rule comparison I've been doing to see what direction to go.)
Also package size is a big factor, on a 256 or even 484 on 6 layers, and mostly lower speed signals you can get by with 5mil traces and get a decent fanout.
On the 900 pin package, unless you have layers or pins to burn, 5mil isn't going to be fun.
I agree with NorthGuy, in quite a few cases you can route around it and when it costs $400 - $1k a pop I do.
At $200 ish, my time and sanity is well worth the premium.