Let your assembly house do it, or at least get input from the assembly process and depanelizing process.
I've seen many engineers make bad panel mistakes that resulted in depanelizing nightmares. Components too close to stress lines, no clearance around rat bites for removal, no routing around overhanging components, etc. Can your panel be reflowed in a reflow oven without sagging? Is it too large for proper support in screen printing/pick and place? Does it have properly sized rails so it can be inspected in AOI while the edges are clamped? Are the PCBs oriented in a way that optimizes stencil creation and solder paste release? Every board/panel has an ideal configuration that avoids assembly issues and reduces assembly cost.
For our customers, we review and recommend panel layouts that best work with the manufacturing and assembly process. (of course, we also provide the PCB, stencil, and assembly so you should never have to even see the panel)