Reflow oven for home use

[tggzzz]

While heating the fan is not used.

I didn't realise turning the fan off was an option; when thinking about using it to cook food (!) I decided that the fan would be essential.

In which case I would question the evenness of the heating and whether or not tall components would produce a shadow, or thick components delay the heat reaching the solder paste. At least with a saucepan+sand the heating is even and traverses a uniform thickness (1.6mm) before getting to the solder paste.

[Simon]

While heating the fan is not used.

I didn't realise turning the fan off was an option; when thinking about using it to cook food (!) I decided that the fan would be essential.

In which case I would question the evenness of the heating and whether or not tall components would produce a shadow, or thick components delay the heat reaching the solder paste. At least with a saucepan+sand the heating is even and traverses a uniform thickness (1.6mm) before getting to the solder paste.

I was refering to the T962 not the food cooking oven perhaps i misunderstood.

[zapta]

The 2 temperatures are displayed during the process and often there is as much as 12° between them but they are equally spaced from the centre and they are on the same line in between the 2 heater elements so I can't really see why they differ so much presumably it's a calibration problem.

Mine also shows two graphs and I always assumed that one is the target temperature and the other is the actual.

[Simon]

There is also an actual readout of current temperature next to the graph. on mine the expected graph is shown and gradually replaced with the actual temperature points measured. so I don't know, maybe one of those measurements is expected and the other actual but there are two probes hanging in the oven chamber

[DerekG]

At least with a saucepan+sand the heating is even and traverses a uniform thickness (1.6mm) before getting to the solder paste.

I wonder if it would be worth placing a sheet of alfoil on top of the sand? This would keep the sand from touching the bottom side of the board.

[tggzzz]

At least with a saucepan+sand the heating is even and traverses a uniform thickness (1.6mm) before getting to the solder paste.

I wonder if it would be worth placing a sheet of alfoil on top of the sand? This would keep the sand from touching the bottom side of the board.

Possibly, but it might introduce other effects. It would reduce the probability of a few grains of sand getting onto the top/component side of the board. They can be brushjed off and don't cause any problem, but it is fundamentally inelegant.