Reflowing my first BGA: Tips needed

[lawrence11]

So I have my controleo3 all ready, its been "learned", the profile program has been tested.

I am reflowing on 1 chip ATM due to them being the only leadfree BGA of the gang, a 216 bga .8mm  with no balls in the middle.

Should I risk aligning manually? Or should I contatc somebody with an xray to help? Is manually best I can good enough?

Should I put some flux on the pcb copper pads of the bga?

This my flux https://www.amazon.com/Solder-Welding-Electronic-Soldering-Lead-free/dp/B076M49M63/ref=sr_1_47?keywords=solder+flux&qid=1568731253&s=gateway&sr=8-47

[lawrence11]

I need an answer.

[spongle]

yes

[lawrence11]

yes to what exactly?

any other details?

[asmi]

I always manually align BGAs and place them on top of a solder paste. Precision is not required because BGAs will self-align once solder melts.

[lawrence11]

Some people say to tin them instead.

Would like to see a video of people tinning bga pads, what tips they use etc...

I hav a good soldering iron hakko fx-888 and some various tips I bought.

Problem: I never really soldered these ypes of things, I m noobie. But I want to get better, Im ready.

I even got my magnifier helmet type thing 3.5x with a LED.

I have a stencil, but I cut off the bga section with a razor blade as I thought the chip was going to get in my way when I wanted to apply paste for the other components and I read we shouldnt mix.

What I have is a tiny bga stencil, barely bigger than the holes. Yeah... Its complicated...

Please help me get through this

[asmi]

Some people say to tin them instead.

Who says that? For BGAs you need as flat surface as you can get. OSP/ENIG/immersion silver are the best. If you have to replace the chip, you need to clean pads from old solder before you place a new one. Add some flux, place a part and apply heat. Just make sure you don't blow the part in the process.

I hav a good soldering iron hakko fx-888 and some various tips I bought.

You need hot air gun, not iron.

I have a stencil, but I cut off the bga section with a razor blade as I thought the chip was going to get in my way when I wanted to apply paste for the other components and I read we shouldnt mix.

Like I said, add some flux and use heat gun. It's good enough for a one-off board.

[lawrence11]

I dont know asmi... That seems dangerous for a 27$ ARM chip that I only have 1.

What about my controleo 3?

[asmi]

I dont know asmi... That seems dangerous for a 27$ ARM chip that I only have 1.

You probably spend more for a dinner... If you will somehow destroy that one - buy another one. I routinely reflow significantly more expensive FPGAs.

What about my controleo 3?

I dunnow. There is a lot of folks promoting it over here. I'm not one of them.
Like I said, for just a single part I would use hot air gun. I use reflow oven only for complete boards.