I just bought a T962, applied some well know modifications and did a quick test on an old PCB with a TSSOP IC and just a stripe of solder paste (no stencil)
I did not expect good result, which was correct. Had to remove many shorts afterwards. (Tried it because I read other people do it as well)
Now I want to test with stencil, which leads me to some questions.
My idea is to make a (low cost, but testable) PCB design just for reflow testing. Order this design with stencil at one of the famous companies. I wanted to add at least a small BGA 0.5mm pitch, a QFN 0.6mm pitch and a TSSOP.
Parts already selected: I2C I/O expander, 16 bit buffer and an MSP430 microcontroller. Basically it is easy to create some microcontroller S/W which is capable of testing most of the connections. (was planning to route all connections via THT pin header as well)
Now my questions.
1. I am not the first DIY reflower, aren't there any similar designs/kits available just for reflow testing. I have the feeling I am re-inventing the wheel.
One of my first target boards will contain a $120 QFN, I do not want to have to throw it away.
2. I have not used a stencil before, how to avoid solder past 'move' when lifting the stencil, are there any tricks ?
(e.g. if the PCB is fixed between some other pcb's, the stencil is taped on one side and you lift it from the other side. Will that work ?
3. Any DIY reflow experiences with 0.5mm pitch BGA ?
4. One of my real targets for reflow will be an RPI CM4 which has fine pitch connectors. Anyone reflowed this at home ?
5. Any other tips/suggestions are more than welcome