It looks very solid and neat and simple and efficient, and I am keen to know when they are available.
The milling and drilling work is done, I expect the stencil printers in about a week back from anodizing.
I notice it holds boards with a channel in the edges of the side pieces. How does it handle different thickness boards?
There are two channels, 1.0 mm and 1.6 mm.
And do you get flexing issues when printing on wide boards?
It depends on the thickness of the pc-board and the force on the stencil. Because the squeegee is supported by the both board holders, the force on the pc-board can be quite low.
But the stencil printer is more or less a vise for the stencil with a massive holder for the board, so it is more or less impossible to move the stencil relative to the board. So, when the pc-board is bent, the stencil and the pc-Bard are bent together.
To minimize the forces on the stencil, I started with a solder paste with low viscosity. Surprisingly, the print quality increased with increasing viscosity.
Increasing viscosity means that at the end the solder paste has the viscosity of plasticine, with the appropriate forces on the stencil / pc-board. It was a bit like filling holes in a wall with smoothing cement. As a result the solder paste was formed to tiny 'bricks' on the 0.5 mm pitch pins and my 144 pin FPGA was soldered perfectly. (I think this could work with other stencil printers too).