Again, it's probably not a big deal in the slightest if you're going to hand assemble.
If you can, try to ensure two things: first, that there is at least some solder mask between the via hole and the pad. This will stop any solder from wicking into the via. Second, on smaller components (generally below 0603), you should try to ensure that the thermal mass on each side of the component is equal. If they're not, then in the reflow process the paste on one pad may melt before the other and the component can "tombstone".
Finally, unless you're dealing with some really fast edges, a millimeter or two of extra trace length isn't going to matter at all. You've gained more in the move from through-hole to surface-mount than you're going to give away unless your layout is really terrible.
Be careful about via-in-pad. Your board manufacturing costs would be higher as the via needs to be filled and plated ->
http://i.screamingcircuits.com/docs/Via_In_Pad_Guidelines.pdf