Electronics > Manufacturing & Assembly

Via under 0805

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Ice-Tea:
Just wondering, what are the thoughts on a (tented) via under a 0805? I know it is not prefered, frowned upon but... Why? If it's tented, it won't suck up solder, I know traces are run under chips so (and I do it all the time) but... Vias? Yay or Nay?

(Also, I wanted to use Glow)

janekm:
I don't see any issue aside from that the unbalanced thermal connection of the pads could, theoretically, contribute to tombstoning but I don't honestly think it's likely (and I very frequently see chip components laid out with 3-spoke connection to ground, and/or via, on one end and a single trace on the other side, so...).

DerekG:

--- Quote from: Ice-Tea on September 29, 2016, 08:09:17 am ---Why? If it's tented, it won't suck up solder

--- End quote ---

This is not likely to cause any problems. Some board shops may charge more for tenting the vias.

I often specify a solder paste stencil of 0.2mm thickness to lay down a bit extra solder. Many stencil suppliers offer you standard (as they are cheaper to make) 0.1 or 0.15mm thick stencils.

In your example, to get the auto-router working, you will need to modify the keep out region for the 0805 resistor.

ataradov:
Nay. In such small spaces, you are likely to see thicker solder mask (SM + trace), so your component will rock on that central point. This may create problems with automatic assembly.

EDIT: Although on 0805 it probably does not matter that much.

AndyC_772:
It's completely fine, a total non-issue with an 0805.

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