if you have a spray etcher, this stuff will eat a 18x24 inch doublesided panel in under a minute. It's what they use in the real PCB fabs. FECL is long gone.
That is not quite true. I don't remember which one but either JLCPCB or PCBWay was clearly showing FeCL3 etching in one of their factory tours. It is still a rather common process because it is both cheap and the chemicals can be reused. Moreover, one doesn't care about mess or that the etchant isn't clear on an automated line where the mess is contained inside of the machine anyway.
Persulfate is nice - if you can get it cheaply and thus can afford to make a new batch every time because it doesn't store well (it decomposes). Also not quite sure about the ability to regenerate it, given that it decomposes during etching ...
fecl is not usable on tin mask. Any board with plated holes uses tin mask. Maybe on some cheapo single sided board you can still use fecl. i don't know of any of my fabs that still use it.
Regeneration is done by cooling the etchant to around 0 degree C . This crystallize the metal sulfate without touching the remaining ammonium persulfate. The crystals are then removed (centrifuge) and the remaining etchant is sent back into the etcher and topped off with fresh ammonium persulfate.
The metal sulfate crystals are then sent for extraction of the copper.
There are two base principles for etching circuit boards :
- acidic (Ferro chloride and copper chloride) or alkaline (Persulfate)
pro's and cons:
Acidic :
PRO Acidic is precise but slower than alkaline
PRO acidic does not react with the photoresist
PRO acidic minimizes undercuts so you get a more vertical wall (this is due to the etch rate)
PRO CuCL is used as etchant (NOT fecl !)
PRO CUCL has a constant etch rate, FECL doesn't
CON : Fecl is not compatible with tin resist so not usable for outer layer etch on double or multilayer !
CON : FECL is expensive to get rid off !
CUCL needs addition of HCL and extraction of chlorine gasses . chlorine gas destroys machinery and humans... so you need extra safety measures.
CON : regeneration is electrolytic and requires special macinery , high currents
Alkaline:
Pro : cheap
Pro : compatible with tin mask ( multilayers and double sided. anything that uses plated holes ) . you could use CUCL for the core , but why mess with two chemistries in the fab ?
PRo : easy regeneration (cool and mechanical separation -> send out for recycling)