Loki G'day,
I have a small selective soldering fountain with selectable nozzles , wave height, pot temperature and solder pump duration controls.
Depending on the alloy give Yourself 40 to 60C head room in solder pot temperature over liquidus.
Depending on mechanical aspects of components You are soldering, give Yourself sufficient jet height for solder to penetrate the PTH hole but not flood the top surface.
Depending on componentry ( heavy leads?) and recommended soldering process window set the contact time with the solder jet accordingly.
Generally I select the nozzle to suit the range of components ( for example I use a 30mm nozzle to solder a row of pins on a relay ).
At 240C I typically set contact time for 3 to 4 seconds for conventional undemanding components.
The other important aspect is the flux. I have settled on an a flux from AIM not because it is the best but because it is the best readily available i have found.
I would be interested to hear which flux You are using.
As You can imagine since I am talking manual operation, I solder an area / set of features at a time and then when the solder pump subsides I move onto the next feature.