Hej Everyone,
I got a custom ASIC in a WLSCP package. The thing is tiny: 0.5mm pitch, 0.25mm bump diameter, with a total outline of 5.3x3.2mm.
I will receive a handful of them and would like to be able to test them on a evaluation board.
Since I do not have access to some professional solutions, i would like to get some advice on solutions, where I don't have solder the ASIC onto test board.
The best idea that I have come up with so far, is to create a custom holder, where outline of the package will just fit into.
Then i would apply some pressure from above to make contact with the PCB. Has anyone tried something like this with a bga perhaps?
I'm curious to hear any ideas of how to approach this.