..Hmm,
the T.C. curves are rather "discrete" (10 degree steps)
What I am fully missing is any specification for temperature hysteresis. (only switch off hysteresis which is rather large)..
The chip has been released to market, ADI writes.. So it is up to the voltnuts here to elaborate in very detail..

The hysteresis interpretation (in comparison to the LTZ/ADR1k designs) could be tricky with such a part as it is ovenized with all components (except the RISET resistor) on the chip. Unless it comes to the "thermal deregulation" it should show no hysteresis, I would say (provided the RISET has zero hysteresis).
Would be great to see some precise measurements here.
I plan to look at the output voltage of myADR#1 in the LAB2 this week, afterwards I would make again a change (out of my curiosity) - I would set the temperature to 40C (TSET wired to 6V6), add the RILIMIT into the heater and a Wima 100n between BUF_F and BUF_S. The chip temperature change will move the output voltage significantly.
As discussed here a year back my wiring of the 2x10k resistors to the TSET led to significant chip temperatures, for aprox 30-40 hours long, and that could be considered the annealing process after the soldering the package into my trampoline wiring, as the DS indicates, even though ADI "has not thoroughly
investigated the efficacy of this approach"..
