Electronics > Metrology

ADR1399 reference

<< < (68/71) > >>

ivo:

--- Quote from: Andreas on November 06, 2024, 10:21:08 pm ---It seems that LS8 package needs longer time and more drift to settle than the TO-46 package which seems to stabilize after ~1 week.
Measurements are still without T.C. compensation since I want to wait with T.C. measurement until the units are sufficient stable.

--- End quote ---

Can you share what circuit scheme you intend to use to remove... 0.2ppm tempco?

Have you looked if the LCC or TO46 package have any difference in 1/f noise?

Andreas:
Hello,

T.C. will be only calculated out (mathematically) for the ageing drift.

Up to now I have only noise figures from LS8 packages on PCB#1

https://www.eevblog.com/forum/metrology/adr1399-reference/msg4445218/#msg4445218
https://www.eevblog.com/forum/metrology/adr1399-reference/msg4453792/#msg4453792

so obviously  a good idea to make some measurements on PCB#2 + PCB#3

with best regards

Andreas

CalibrationGuy:
Andreas, I've been inspired by your efforts. I am working on aging boards. Here's a picture of my ADR1399 farm ready for planting!

TomG.

CalibrationGuy:
The boards will go in this oven for a few months. Anyone have any suggestions as to optimum aging temperature? I was thinking 40/45 degrees C. Thoughts?

TomG.

Kleinstein:
Aging should be at a higher temperature. Under normal operation the temperature is regulated to some 90 C. So that or a little higher would be the logical temperature for aging. This could be done by using the chip internal heaters.

Navigation

[0] Message Index

[#] Next page

[*] Previous page

There was an error while thanking
Thanking...
Go to full version
Powered by SMFPacks Advanced Attachments Uploader Mod