Andreas,
I understand you are reluctant to accept the (H)LS package as a full value in the small world of high performance references. Probably you are right, but wouldn't it be better to rely on figures and experience than just on an "emotional feeling". Why not do real, objective testing when such device comes available and produce some figures, data that allows to place them where they belong: Excellent, good but only for.., just average?
After all is that n ot what this blog is all about? Experiment and search for inmprovement?
"Generally all SMD packages suffer more from PCB stress than CERDIP or even TO Packages". Yes, but since the thing is hardly 5*5mm, how bad is that suffering? (again: figures).
So, once again, has anyone any idea if or when this could be available?