- The 'A' version is the same die, but with a die attach method that is thermally insulating. This helps a lot if you are running your reference on battery power-- it will save around 20% energy vs. the non-'A' part if run at the same die temperature. LT (now ADI) applications engineers have said that the 'A' version has less hysteresis through power cycles. Since the non-'A' version can be run at 10oC lower die temperature, the 20% energy savings is dubious. The leads on the 'A' version will be cooler-- so that is a big plus in managing thermal EMFs between the Kovar leads and the copper board traces-- (the idea is that you want to keep all of these junctions balanced and at the same temperature). Because of the die-attach method used in the 'A' version, it is advisable to have a high-temp (125oC) burn-in period where the entire burn-in period is 15-minutes ON and 15-minutes OFF. This exercises the die-attach so that spurious jumps are suppressed. This burn-in process must be followed by a conditioning process (like the Pickering Patent). Because it uses a (more or less) ordinary die attach method, the non-'A' version does not require this special burn-in procedure-- but it still needs a 90-day (or so) burn-in (always ON) to 'settle' before calibration.
All my LTZ1000 run at about -measured- 50...54°C (12k/1k), and each circuit consumes in total about 25mA.
The PCB and the device are inside an insulated box, so that assembly heats up to about 10°C above ambient.
At 22°C R.T., that makes about 20°C difference to heat up for the LTZ1000. From the datasheet diagram, that's about 100mW or 20mA heating power @ 240 Ohm heater resistance, which gives exactly these 25mA, when including OpAmps and reference supply.
I did not -yet- check for LTZ1000A, but the same calculation yields: 12.5k/1k => 62°C, about 30°C difference (due to higher thermal insulation) => 80mW, 18mA heater power, which would give 2mA less current consumption only (23mA in total). Maybe somebody else can confirm that value for the LTZ1000A.
The only advantage of the A version would be a warm-up time of <1sec, compared to 20..30sec for the non-A version.
I still do not recommend such a 'burn-in', as it will only introduce big hysteresis, as measured and proven by Pickering, hp in their drift - AN18A, and by my own measurements.
Even if one applies the Pickering method, it's really difficult to get to the virgin state, if ever possible.
I would estimate, that the theoretical relaxation process by burn-in is minor compared to the hysteresis effect, so better never excessively heat the LTZ1000 / A device, neither by soldering (no short leads either), nor by 'burn-in'.
Anyhow, nobody knows -up to now- how LT tests the finalized LTZ1000/A devices.
As it's specified for -55/+125°C operating temperature, maybe they test it 100% for both temperatures at the final tester, although the datasheet implies testing parameters at 25°C only.
That might leave the finished device in an unknown hysteretic state, and some devices will stay there indefinitely, others may drift towards their virgin state.
So the initial drift of several ppm/ x months may arise from such a final test over temperature, but not being the 'real' annual drift.
I have encountered initial drifts between zero and -2.5ppm / yr. for
all of my seven LTZ1000 / 50°C references, either after assembly, or after erratically over-heating and re-conditioning.
After that time, all seem to approach the typical -0.8ppm/year, or less.
So I again recommend to just leave them alone, as burn-in may do more harm than will really / practically / measurably improve the long-term drift.
Frank