I've done a high temperature storage at 120°C on my LM399 reference board for more than 300h and the color has changed clearly. I can't see such an evidence on the pictures of the reference boards or even the pcb material on the 3458A reference boards.
Whatever burn-in means for several manufactors, power the circuit up or power the circuit up driving a temperatur profil, most things discussed help keeping a myth alive.
I appreciate an offical publication that do away with all that fairy tales.
leaded solder gets soft from 105°C onwards, leadfree a little bit higher.
That softening (euthetic phase) will harm the solder junction.
Therefore, any storage or cycling of soldered PCBs above 110°C will definitely destroy the solder junctions, or at least deteriorate the reliability greatly.
It's possible only to make such high temperature storage of non assembled components. Here, the max. die temperature of about 150°C is a limit.
Getting close to that temperature will also harm the silicon structure already, due to Arrhenius law.
Burn-In usually is done on components, which have a big drift rate intrinsically, and the purpose of the burn-in is to accelerate those drifts to a state, which otherwise would be reached only years later.
Another technique is to burn-in a completely assembled PCB (at 90°C max.) to detect early failures and so to get more reliable PCBs, especially under rough conditions as spacecraft, military and automotive applications.
But latter goal is not ultimately required for volt references.
So I stick to my opinion, that a real burn-in on ultra precision components, i.e. on components which have low drift rates by design already, will do more harm than really improve the stability further.
Frank