Anyway, why the SMD-flash on the PDA was attached to the PCB with resin? That's really evil!
Why do you need glue or resin? I experimented a true nightmare on a second already dead PDA ... the typical lead-free solder has a melting point around 220 degrees C, so I did preheat the board close to 200 C and continued with the hot air gun, but when I tried to remove the chip, I found there was "something" under the chip, and it was working as glue. Then I realized that it was a thin film of resin, or something, and it was so resistant to the hot air that I was not able to remove the chip, even if I used a lot of force on the extractor with the hot air gun at 300 C degree.
In the end I destroyed the PCB, to check what was wrong. And I am still shocked to have found a kind of glue under the chip. I still do not understand the reason for this.
I have removed the same SMD-flash chip on my Motorola EZ development board. Thanks to a "relaxed" design (I mean the board is really large, 110x100mm, with a lot of distance between components) there is a lot of space around the SMD-flash, no plastic near the area, and there is neither resin nor glue under the chip, so I didn't experiment so many troubles!