Thank you all for comments.
The pointed ug116.pdf is really informative document. Thank you very much!
The main interest for me currently is program/erase endurance test under room and hight temp(! that table seems to miss), HTOL and TH/THB tests data. Then data for non-hermetic and hermetic packages, reliability data for certain packages, etc...
Some data seems to me quite strange. For instance, Actual Device Hours at TJ >=125°C and Equivalent Device Hours at TJ=125°C of 61,012 / 1,208,215 for XC4VxXxxx devices...
All in all, quite a bit of useful data to analyze...
Thanks to all very much again.