Electronics > Microcontrollers

NXP/LPC - Detecting device type

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Fred27:
Sorry - reading it again you did explain that clearly!

JJalling:

--- Quote from: Fred27 on August 04, 2021, 08:38:37 am ---Sorry - reading it again you did explain that clearly!

--- End quote ---

No worries. I think that I'll stick with that solution for now and see if anything explodes.

Thanks!

BR Jonas

abyrvalg:
The fact that some i/o pad of the same die is not bonded out shouldn’t affect anything, it’s the same as unconnected pin. But if you want to stay 101% formal you can strap some pin existing on both packages differently on each board type (pull down on one, up on another).

JJalling:

--- Quote from: abyrvalg on August 04, 2021, 03:16:19 pm ---The fact that some i/o pad of the same die is not bonded out shouldn’t affect anything, it’s the same as unconnected pin. But if you want to stay 101% formal you can strap some pin existing on both packages differently on each board type (pull down on one, up on another).

--- End quote ---

I agree, but it's hard/expensive to change an old hw design with 10k-50k units in the field - it's easier/cheaper to do stuff in software.

Br Jonas

nctnico:

--- Quote from: JJalling on August 04, 2021, 08:07:11 am ---
--- Quote from: nctnico on August 04, 2021, 07:56:45 am ---You can read the part ID through the IAP API. There is a list somewhere with part IDs. The source code from this project is likely a good start to get a list: http://www.windscooting.com/softy/mxli.html#Latest

--- End quote ---

The part-id is the same for the two chips - only the package size/pin-count differ.

--- End quote ---
Bugger. I thought they had different ones but looking at Flash magic it seems they used the same part ID indeed. In your case I'd also use existing pins with known states which aren't bonded out on the 48pin package.

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