Hi all. I'm working on a ultra small form factor design which has a goal of using as TINY parts as possible.
As part of the challenge, I need to find a PMIC that can power my CPU while being as small as possible.
All WLCSP parts I can find are offered in 0.4mm pitch, not 0.5mm, therefore standard 0.1mm/0.1mm PCB process without microvia cannot layout this.
I only need to bring a few balls out, not all.
Essentially, I cut 1/4 of the 0.2mm ball pad to satisfy 0.3mm spacing between 2 pads, so that I can route 0.1mm trace in between.
Do you think this is a viable solution, or a stupid one?